Shipping CE · FCC · RoHS · EAC certified PCs worldwide
EN·RU·ES·AR · Mon–Sat 09:00–19:00 GMT+8 · [email protected]

Your brand. Your SKU.
Your packaging.

For orders of 50 units or more, every SZO product can ship under your own brand — your logo etched on the chassis, your part numbers on every label, your packaging design, your spec sheets. ShenzhenOPS does not appear anywhere in your end customer's experience. NDA signed before any specification exchange.

White-label OEM transformation: SZO branding to your brand
Three Tiers of Customization

Pick the level that fits your project.

Tier 1

Light Branding

From 50 units
  • Your logo printed/etched on chassis
  • Custom SKU label on packaging
  • Standard SZO products inside
  • Generic brown shipping carton
  • SZO documentation re-stickered
  • Custom motherboard layout
  • Custom packaging design
  • Custom spec sheet artwork
Tier 3

Full ODM

From 500 units
  • Everything in Tier 2, plus:
  • Custom I/O configuration
  • Custom thermal/chassis design
  • Custom BIOS branding & boot logo
  • Custom motherboard layout (if needed)
  • Exclusivity options by geography
  • Dedicated production slot
  • Joint roadmap planning
Capability Matrix

Exactly what's customizable at each tier.

If you're trying to figure out which tier matches your project, this matrix answers the most common questions buyers ask in initial scoping calls.

Customization Tier 1
50+ units
Tier 2
100+ units
Tier 3
500+ units
Chassis & Hardware
Logo printed/sticker on chassis
Laser-etched logo on chassis
Custom chassis color/finish+$8–15/unit
Custom chassis dimensions/shapeTooling fee
Custom I/O port configuration
Custom motherboard layoutNRE fee
Thermal design (fanless, wide-temp)Limited options
SKU & Labels
Custom SKU / part number
Custom serial number format
Custom barcode / 2D code
Sequential serial blocks (your prefix)
Packaging & Documentation
Re-stickered shipping label
Custom color box (your design)
Custom foam / insert tray
Custom user manual (your brand)
Multi-language documentationUp to 4 langUnlimited
Quick-start guide & cards
Software & Firmware
Pre-installed Windows / Linux imageStandard imageYour image
Pre-loaded applications & drivers
Custom desktop / wallpaper
Custom BIOS branding & boot logo
Custom Android ROM (tablets)
MDM-ready provisioning
Certification & Compliance
Ship under factory cert + your re-label
New CE / FCC under your brand+$1,500–4,000
New EAC under your brand (Russia)+$3,000–6,000
Local-market certifications (BIS, SASO, etc.)
Commercial & IP
Mutual NDA signed pre-spec
Brand exclusivity (your name)
Geographic exclusivityVol commitment
Hardware-design exclusivity (no resale)
Dedicated production line slot

3 more categories: Software & Firmware · Certifications · Commercial & IP

Engineering Process

Six steps from brief to delivery.

1

Brief & NDA

You share volume target, branding direction, target markets, certification needs, and any specific hardware requirements. NDA signed before we exchange any specifications.

  • Mutual NDA, covering both parties
  • Discovery call (45–60 min)
  • Initial volume & timeline estimate
Day 1–3
2

Quotation & Mockup

Quote within 48 hours. For Tier 2/3 projects, we prepare branded mockups of chassis etching, packaging artwork concepts, and documentation samples.

  • Detailed BOM-level pricing
  • 3D rendering with your branding
  • Packaging artwork mockup
  • Lead time commitment
Day 3–10
3

Paid Samples

1–3 sample units with your branding for your engineering, marketing, and certification teams to evaluate. Shipped via DHL/FedEx.

  • 1–3 fully branded sample units
  • Real packaging samples
  • Documentation drafts
  • 5–10 day delivery via express
Day 10–25
4

PO & Production

30% T/T deposit (or LC at sight for large orders) triggers production. Components are reserved in dedicated batch. Pre-production engineering checkpoints with you.

  • 30% deposit triggers material order
  • Engineering checkpoint mid-production
  • Burn-in testing per unit (24-hour)
  • Sample units from production line
Day 25–60
5

QC & Inspection

Multi-stage QC: incoming materials, in-process line checks, finished-unit testing, packaging inspection. Optional 3rd-party inspection by SGS/BV/TÜV.

  • 100% functional test per unit
  • Statistical sample for stress test
  • Pre-shipment QC photos
  • Optional 3rd-party inspection report
Day 55–62
6

Ship & Aftersales

70% balance against B/L copy. FOB Shenzhen, CIF, or DDP shipping. 2-year warranty with RMA handled through Vincent personally.

  • Mixed-SKU container loading
  • Pre-shipment documentation set
  • RMA & spare board stocking
  • Optional 3-year extended warranty
Day 62+
Quality Control

Four checkpoints per order.

QC isn't a single end-of-line check. Every order passes through four independent quality checkpoints before leaving the factory.

📦

IQC — Incoming Materials

Every component batch (CPUs, RAM, SSDs, chassis parts) is sampled and tested on arrival. Defective batches are returned to component supplier before they enter production.

🔬

IPQC — In-Process Inspection

Line inspectors verify assembly correctness at each station: solder joints, screw torque, cable routing, thermal paste application, gasket seating. AQL 0.65 sampling on non-critical defects.

🧪

OQC — Outgoing Functional Test

100% of finished units undergo automated functional test: CPU stress (4-hour minimum), memory test, all I/O ports verified, WiFi/BT/cellular validated, screen pixel check (tablets/laptops).

📸

Pre-Ship Photo Review

Before container loading, we photograph the actual production batch and send to you for review. You confirm or flag issues before final shipment. Optional 3rd-party inspection (SGS/BV/TÜV) for orders 200+ units.

Start a project

Let's discuss your white-label needs.

Send a quick message describing your volume, branding direction, and target market. Vincent responds within 24 hours with a clear next step — usually a 45-minute discovery call before any spec exchange.

VY
Vincent Yu · Founder
ShenzhenOPS · Shenzhen, China
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